Upisel

Features

• This is a non-adhesive-type copper-clad laminate based on polyimide filme (Upilex-VT). We also offer heat-dissipating substrate materials with a thinner insulation layer by utilizing the highly-insulating, pressure-resistant characteristics of polyimide.

Applications

• TAB, COF, lead frame fastening tape, FPC (high density, reinforcement panel), OA equipment, flexible photovoltaics, speaker diaphragms, heavy electrical equipment, etc.